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Metal stamping
EMI shielding cans and frames
Sierxi stamps custom board-level EMI and RF shielding cans, frames and snap-on covers on progressive dies in Suzhou. We work in 0.15–0.3 mm C7701 nickel silver, SPCC, SGCC and SUS304, hold ±0.02 mm on flatness-critical features, measure solder-flange coplanarity on every lot and quote from 1,000 pieces.
Capabilities at a glance
| Part types | One-piece cans, two-piece frame + cover, fences, perforated covers |
|---|---|
| Materials | C7701 nickel silver, SPCC, SGCC, SUS304 |
| Typical thickness | 0.15–0.3 mm |
| Tolerance | ±0.02 mm on critical features |
| Tooling | Progressive dies with in-die forming |
| Minimum order | 1,000 pcs |
One-piece or two-piece shielding can?
A one-piece can is cheapest and is soldered straight onto the board. A two-piece design — a soldered frame plus a snap-on cover — lets you rework or inspect the components underneath, at the cost of a second die.
Send us the PCB footprint and component heights and we will suggest the layout, including pick-and-place pads, vent holes and corner reliefs.
| One-piece can | Two-piece frame + cover | |
|---|---|---|
| Tooling | One die | Two dies |
| Unit cost | Lowest | Higher (two parts) |
| Rework under the shield | Can must be desoldered | Cover snaps off |
| Height | Lowest profile | Slightly taller where cover overlaps frame |
| Typical use | Stable, mature designs | Boards that need test access or rework |
Shielding can design guidelines
These are typical guidelines for stamped board-level shields. Final values depend on your reflow process, component heights and the frequencies you need to block, so treat them as a starting point for design review.
- Solder-flange coplanarity: set the limit your reflow process needs; many boards call for about 0.1 mm or tighter across the flange
- Internal clearance: leave a few tenths of a millimetre above the tallest component plus its height tolerance
- Pick-and-place pad: a flat, unperforated area near the centre of gravity, larger than your placement nozzle
- Vent and inspection holes: keep each opening small compared with the wavelength of the highest frequency of concern — a common rule is under one-twentieth of the wavelength
- Corners: use relief notches or lanced corners so walls form cleanly without cracking
- Wall height and thickness: thin material (0.15–0.2 mm) keeps weight down but needs ribs or beads on large flat lids
- Snap-on covers: specify the retention method (dimples, bumps or latches) and the required removal force
- Burr direction: keep burrs away from the solder flange face so they do not lift the can off the pads
Materials for shielding cans
| Material | Solderability | Why choose it |
|---|---|---|
| C7701 nickel silver | Good without plating | Solders well, good shielding, stays bright |
| SPCC cold-rolled steel | Needs tin or nickel plating (partner) | Low cost, magnetic — useful for low-frequency shielding |
| SGCC galvanized steel | Limited; usually mechanically fixed | Corrosion-resistant covers and fences |
| SUS304 stainless steel | Difficult; needs plating or special flux | Strong thin covers that resist denting |
Flatness and coplanarity
Shielding cans fail at reflow when the solder edge is not flat. We measure coplanarity of the solder flange on a vision measuring system at first article and on every lot, and include the results in the dimensional report.
Flatness is designed into the die rather than corrected afterwards: strip layout, forming sequence and the final restrike station are reviewed with our toolroom partner before the die is built.
Where board-level shields are used
Stamped shields cover RF modules, wireless chipsets, processors, memory and switching power stages on boards for consumer electronics, networking equipment, industrial controllers and test instruments. The aim is the same in each case: keep noise from one circuit away from its neighbours and help the product pass EMC testing without a full metal housing.
The shield is only part of the solution. Its performance also depends on the ground pad ring on the PCB, via spacing along that ring and the gaps between solder joints, so the can and the footprint should be reviewed together.
Packing shielding cans for SMT lines
Thin cans dent and nest easily, so packing is chosen per project. Options include formed trays, anti-static bags and tape and reel for automatic placement. Tell us your placement machine and reel requirements with the RFQ and we confirm the packing in the quote. Freight is quoted per destination.
What to include in a shielding can RFQ
- Can drawing with outline, height, wall thickness and flange width
- Material and finish (for example C7701 unplated, or SPCC with tin plating)
- Coplanarity requirement and how it is measured
- PCB footprint and component height map, if available
- One-piece or two-piece design, and annual volume
- Packing: bulk, tray or tape and reel
Frequently asked questions
Can you supply shielding cans in tape and reel?
Tell us your packaging requirement with the RFQ. We confirm packing options, including trays and tape and reel, per project.
Do you need a PCB layout to quote?
A drawing of the can is enough to quote. A footprint and component heights help us check the design before tooling.
What is the best material for a solderable shielding can?
C7701 nickel silver is a common choice because it solders well without plating. Tin-plated steel is cheaper per kilogram but adds a plating step.
Can you make shielding cans without a die for prototypes?
Thin cans are normally produced on a progressive die. For early prototypes, ask us — we confirm the most practical sample route per project in the quote.
How is solder-flange coplanarity checked?
On a vision measuring system at first article and on every production lot. Results are included in the dimensional report.
What is the minimum order?
1,000 pieces per part number.
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